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With participation from Lionel Spack at Nestlé, this event aims to address packaging challenges and bring experts together.
September 30, 2026
By: Rachel Klemovitch
With registration now open, RadTech Europe announces the RTE Packaging Seminar 2026.
This is a focused event designed to bring together stakeholders from across the entire packaging value chain to exchange perspectives, share expertise and discuss practical solutions.
From sustainability and circularity requirements to food-contact compliance, PPWR implementation, UV LED innovations, and evolving market expectations, the challenges facing packaging professionals cannot be addressed in isolation.
The RTE Packaging Seminar aims to address these challenges and brings experts and representatives together.
Other event topics include packaging sustainability, food-contact compliance, PPWR, low-migration systems, UV LED and EB curing innovations, and future market developments.
A highlight of the seminar will be the participation of Lionel Spack, Senior Expert Food Contact Materials at Nestlé, who will present on the latest developments in the Nestlé Standard on Printing Inks for Food Packaging.
The seminar program also includes perspectives from Nestlé, Keller & Heckman, IST INTECH, KNEHO Lacke and Arkema, culminating in an expert panel discussion that brings multiple viewpoints together.
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